Metal Core PCB

Metal based circuit board mainly includes copper based circuit board and iron-based circuit board.

Copper based circuit board is one of the most expensive metal substrates, and its thermal conductivity is many times better than that of aluminum and iron substrates. Generally, there are gold plated copper substrate, silver plated copper substrate, tin sprayed copper substrate, oxidation resistant copper substrate, etc. It is suitable for heat dissipation and building decoration industry of high frequency circuit, high and low temperature change area and precision communication equipment.

The circuit layer of copper based circuit board is required to have great current carrying capacity, so thick copper foil with the thickness of 35 μ m ~ 280 μ m should be used. The thermal insulation layer is the core technology of copper based circuit board. The core thermal conductivity component is composed of aluminum oxide and silicon powder and polymer filled with epoxy resin. It has low thermal resistance (0.15), excellent viscoelastic performance, and thermal aging resistance It can withstand mechanical and thermal stress. The metal base of copper-based circuit board is the supporting component of copper-based circuit board, which requires high thermal conductivity and is suitable for drilling, punching, cutting and other conventional machining.

 

Cu PCB Technical Manufacturing Capability

 1, Min. line width/space: 8mil/8mil (0.2mm/0.2mm)

2, Min. hole size: 8mil (0.2mm)

3, Layer: 1 layer

4, Max. Board size: 400mm*300mm

5, Finished board thickness: 0.8~3.0mm

6, Boad warpage: <=0.5% (E.g. 1.6mm; Size – 300*300mm)

 

7, Copper foil thickness: 17.5um~140um (1OZ~4OZ)

8, Remain thickness tolerance after V-CUT:+/-0.1mm

9, Hole position tolerance:+/-0.076mm

10, Profile tolerance: routing outline tolerance:+/-0.10mm; punching outline tolerance:+/-0.15mm

11, Surface finished: HAS LF, immersion gold (ENIG), OSP etc